Die-Sized SAW Package (DSSP)
The Die-Sized SAWPackage (DSSP) is a further development of the RF filters and duplexers as Chip-Sized SAW Package( CSSP). The DSSP packages, also developed by Epcos, are even smaller than the smallest CSSP package.
For example, the surface acoustic wave (SAW) filter designed as a DSSP package has a footprint of just 0.8 x 0.6 mm. That's less than 1/2 square millimeter. The duplexers are about twice the size of the tiny RF filters. Their dimensions are 1.8 x 1.4 mm. The overall height is only 0.25 mm.
As can be seen from the designation Die-Sized SAW Package, the package size is essentially determined by the size of the dice. The contact pitch of the DSSP package is only 220 µm. DSSP packages are available for all mobile radio technologies as single filters, 2in1 filters, 4in1 filters and as duplexers.