bump chip carrier (package) (BCC)
The BCC package(BumpChip Carrier) is a miniature package for use in mobile devices, in PDAs, cell phones, radio modems, etc. The BCC package itself is only slightly larger than the chip. The connection dimples for contact with the printed circuit board are only 0.4 mm x 0.3 mm.
This very compact and lightweight package is available with 8, 24, 32, 48 and 64 connections. Package sizes range from 2.8 mm x 3.8 mm, to 4 mm x 4 m, 5 mm x 5 mm, and 9 mm x 9mm for the 64- terminal package. The package height is only 0.8 mm.
The BCC package is available in BCC+ and BCC++ versions, which differ in an epoxy cavity for better heat dissipation and additional ground contacts that reduce ground inductance. BCC packages can be used up to frequencies of 12 GHz, this is due to the fact that the RLC values for the gold-plated leads are very small.
Since the BCC package was mainly available in Japan, a chip-scale package of the same small size was developed with the CSP package, whose design was adopted by many chip manufacturers.