die size ball grid array (package) (DSBGA)

A Die Size Ball Grid Array (DSBGA), also known as a WaferChip Scale Package(WCSP), refers to the packaging of an IC in wafer form. This differs from such packages, which are created after the chip has been cut from the wafer.

The package size of the DSBGA.package is the same as the size of the silicon chip, making WCSP packages the smallest form factor compared to other package types. WCSP is ideal for space-constrained applications such as mobile devices or other portable devices.