flip chip (FC)
Flip chip( FC) is a package technology where the die chip is bonded directly on the substrate or PCB. The flip-chip technology is suitable for a high number of bondings on a small area. It is performed between the die chip and the substrate directly via an array of small bond pads(bumps), which are located as contacts on the surface.
This is why bonding is also called bump bonding. During the reflow process, the bumps melt and the dice are electrically connected to the substrate or PCB.
The bump bonding of flip-chip technology has the advantage over wire bonding that it can have more connections and that the electrical performance characteristics are better because it does not require connecting wires. This is also noticeable in the low inductance of the terminals, which translates into higher frequencies, shorter run times and better pulse response.
The flip-chip technology is available for many packages, such as Quad Flat No-Lead( QFN) as FC-QFN, Land Grid Array( LGA) as FC-LGA, Chip Scale Package( CSP) as FC/CSP and Ball Grid Array( BGA) as FCBGA.