flip chip ball grid array (package) (FCBGA)

Flip Chip Ball Grid Array (FCBGA) is an interconnect technique used to connect the die chip to the contact points.

FCBGA package (from bottom), photo: Intel

The flip chip technique has an advantage over bonding in that there are no bonding wires, allowing higher clock frequencies to be achieved. The die chip lies with its surface on the substrate. Micro-FCBGA technology was developed with the Celeron for mobile devices, which is based on Coppermine. With BGA technology, the packages can be soldered directly onto the motherboard.