hot air leveling (HAL)

The HAL process, Hot Air Leveling (HAL), is used in PCB manufacturing after tinning in an immersion bath. The PCBs are then blown off with hot air and excess solder is removed from the tracks and holes in the areas not protected by the solder mask.

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Englisch:	hot air leveling - HAL
Updated at:	13.12.2019
#Words:	46
Links:	process, protocol control block (TCP) (PCB), solder, mask,
Translations:	DE
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