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micro lead frame (package) (MLF)

The Micro LeadFramePackage (MLF) developed by Amkor is a flat, small and very light plastic package with copper-based substrate.

The MLF package has no leads but only small solder balls located at the bottom of the package that can be used directly for a solder connection to the PCB. The package can have up to 164 connections and is designed to support optimal heat dissipation. The packages have side lengths between 2 mm and 12 mm and a thickness between 0.6 mm and 0.9 mm.

The MLF package is ideal for small mobile devices such as handhelds, cell phones or PDAs.

Informations:
Englisch: micro lead frame (package) - MLF
Updated at: 03.01.2007
#Words: 96
Links: light, package, copper (Cu), substrate, solder
Translations: DE
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