micro lead frame (package) (MLF)
The Micro LeadFramePackage (MLF) developed by Amkor is a flat, small and very light plastic package with copper-based substrate.
The MLF package has no leads but only small solder balls located at the bottom of the package that can be used directly for a solder connection to the PCB. The package can have up to 164 connections and is designed to support optimal heat dissipation. The packages have side lengths between 2 mm and 12 mm and a thickness between 0.6 mm and 0.9 mm.
The MLF package is ideal for small mobile devices such as handhelds, cell phones or PDAs.