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molded interconnect device (package) (MID)

MID(Molded Interconnect Device) technology is used to manufacture spatial electronic or optical components, assemblies and circuits. In contrast to the classic two-dimensional printed circuit board, MID technology uses a part of the housing or another mechanical part as the circuit carrier.

Molded Interconnect Device is a combination of injection molding and subsequent structured metallization, Laser Direct Structuring( LDS), of three-dimensional assemblies. There are several manufacturing and assembly processes for MIDs, but laser direct structuring is commonly used. This process uses special liquid crystal polymers( LCP) that are activated by a laser beam, depositing metal at the exposed areas. Other processes use etching, heat embossing and wet chemical methods.

Surface treated with Laser Direct Structuring (LDS), Photo: Harting Mitronics

Surface treated with Laser Direct Structuring (LDS), Photo: Harting Mitronics

MID components can be, for example, 3D wiring, spatial circuit carriers or LEDs that have a bundled radiation characteristic created with a reflector, or 3D antennas for mobile devices. MID components and assemblies are used, among other things, in sensortechnology, industrial automation and measurement technology, but also in cell phones and automotive technology.

Informations:
Englisch: molded interconnect device (package) - MID
Updated at: 10.10.2014
#Words: 171
Links: mobile Internet device (MID), indium (In), contrast, printed circuit board (PCB), carrier
Translations: DE
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