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shrink small outline package (Chip) (SSOP)

Compared to the Small Outline Package(SOP), the SSOP(Shrink Small Outline Package) design is characterized by a more compact construction with smaller distances between the connections.

SSOP chip with 20 connections, photo: OKI

SSOP chip with 20 connections, photo: OKI

SSOP chip devices are available with 8, 16, 20, 28, 30, 32, 48, 56, 64 and 70 leads, with spacing between 0.65 mm. The square SSOPs have edge lengths of 5.3 mm (8, 16, 20, 24), 7.6 mm (48, 54) and 10.2 mm (64, 70). Compared to the SSOP package, the Thin Very Small Outline Package( TVSOP) is about 50% to 60% smaller and also flatter. The SSOPs are suitable for SMT technology and are specified by the Joint Electron Device Engineering Council( JEDEC).

Englisch: shrink small outline package (Chip) - SSOP
Updated at: 07.02.2012
#Words: 93
Links: small outline package (chip design) (SOP), chip, package, thin very small outline package (chip design) (TVSOP), surface micromachining technology (SMT)
Translations: DE

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