Übersicht über gebräuchliche Abkürzungen die die Bauart und Bauform von analogen und digitalen Chips betrifft:
Antifuse Actel FPGAs
BCA, Bare Chip Attach
BCP, Bare Chip Processing
BEM, Boundary Element Method
BQFP, Bumpered Quad Flat Pack
BTAB, Bumped Tape Automated Bonding
C&P, Collect and Place
C&W, Chip and Wire
C4, Controlled Collapse Chip Connection
C5, Controlled Collapse Chip Connection on Ceramic
CARD, Card Memory
CBGA, Ceramic Ball Grid Array
CCGA, Ceramic Column Grid Array
CDIP, Ceramic Dual Inline Package
CDIP SB, Side-Braze Ceramic Dual Inline Package
CERDIP, Ceramic DIP
CERPACK, Ceramic Package
CFP, Ceramic Flat Package
CGA, Column Grid Array
CLCC, Ceramic Leaded Chip Carrier
CLLCC, Ceramic Lead-Less Chip Carrier
CLGA, Ceramic Land Grid Array
C0B, Chip on Board
CoC, Chip on Chip
COG, Chip on Glass
COL, Chip on Lead
COT, Chip on Tape
CPGA, Ceramic Pin Grid Array
CPLD, Complex Programmable Logic Device
CQFP, Ceramic Quad-Flat Package
CSMP, Chip-Sized MEMS Package
CSOP, Ceramic SOP
CSP, Chip Scale Package
CZIP, Ceramic Zig-Zag Package
DBGA, Dimpled Grid Array
DCA, Direct Chip Attach
DFN, Dual Flat no Lead
DFP, Dual Flat Package
DIMM, Dual Inline Memory Module
DIP, Dual Inline Package
DLA, Direct Lid Attach
DLCC, Dual Lead-Less Chip Carrier
DPAK, Discrete Package
DRMLF, Dual Row Micro Leadframe
DSSP, Die-Chip SAW Package,
EBGA, Enhanced Ball Grid Array
ETQFP, Exposed Thin Quad Flat Package
FBGA, Fine-Pitch Ball Grid Array
FCBGA, Flip Chip Ball Grid Array
FC/CSP, Flip Chip / Chip Scale Package
FC- LGA, Flip Chip Land Grid Array
FC-PGA, Flip Chip Pin Grid Array
FC- QFN, Flip Chip Quad Flat No-Lead
FLFP, Flat Lead Frame Package
FLGA, Fine Land Grid Array
FLEX, Altera FPGAs
FCIP, Flip Chip in Package
FCOS, Flip Chip on Substrate
FP, Flat Package
FPFA, Fiels Programmable Function Array
FPGA, Field Programmable Logic Array
HDA, High Density Array
HDI, High Density Interconnect
HLQFP, Thermally Enhanced Low Profile QFP
HQFP, Thermally Enhanced Quad Flat Package
HSOP, Thermally Enhanced Small-Outline Package
HSSOP, Thermally Enhanced Shrink Small-Outline Package
HTCC, High Temperature Cofired Ceramic
HTQFP, Thermally Enhanced Thin Quad Flat Pack
HTSSOP, Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP, Thermally Enhanced Very Thin Quad Flat Package BR> ILB, Inner Lead Bonding
IPAKIntegrated Package
JLCC, J-Leaded Ceramic or Metal Chip Carrier
LBGA, Low Profile Ball Grid Array
LCA, Xilinx Logic Cell Array
LCC, Leaded Chip Carrier
LCCC, Leadless Ceramic Chip Carrier
LDCCC, Leaded Ceramic Chip Carrier
LFBGA, Low Profile Fine Pitch Ball Grid Array
LFCSP, Leadframe Chip Scale Package
LGA, Land Grid Array
LID, Leadless Inverted Device
LIF, Low Insertion Force
LLC, Leadless Chip Carrier
LLP, Leadless Leadframe Package
LPCC, Leadless Plastic Chip Carrier
LQFP, Low Profile Quad Flat Pack
LSI, Large Scale Integration
LTCC, Low Temperature Cofired Ceramic
MACH, AMD MACH family of CPLDs
MAX, Altera CPLDs
MC, Multilayer Ceramic
MCeP, Molded Core Embedded Package
MCM, Multi-Chip Module
MCP, Multi-Chip Package
MDIP, Molded Dual Inline Package
MELF, Metal Electrode Leadless Face
MID, Molded Interconnect Device
MLC, Multi Layer Ceramic
MLF, Micro Lead Frame
MLP, Micro Leadframe Package
MLPD, Micro Leadframe Package Dual
MLPM, Micro Leadframe Package Micro
MLPQ, Micro Leadframe Package Quad
MMC, Mobile Module Cartridge
MQFP, Metal Quad Flat Package
MSOP, Micro Small-Outline Package
MSP, Mini Square Package
OBGA, Organic Ball Grid Array
ODFN, Optical Dual Flat No-Lead Plastic
OPGA, Organic Pin Grid Array
OPTO, Light Sensor Package
OTP, One Time Programmable
PAC, Pin Array Cartridge
PBGA, Plastic BGA
PGA, Pin Grid Array
PDIP, Plastic Dual-Inline Package
PFBGA, Plastic Fine Pitch Ball Grid Array
PFMP, Plastic Flange Mount Package
PLCC, Plastic Leaded Chip Carrier
PLD, Programmable Logic Device
PoP, Package on Package
PPGA, Plastic Pin Grid Array
PQFN, Power Quad Flat No- lead
PQFP, Plastic Quad Flat Package
PSGA, Polymer Stud Grid Array
PSO, Plastic Small Outline
PSON, Plastic Small-Outline No Lead Package
PSOP, Power Small Outline Plastic
PSOP, Plastic Small Outline Plastic
PTP, Paper Thin Package
QCP, Quad Carrier Package
QFJ, Quad Flat J-lead
QFN, Quad Flat No-lead
QFP, Quad Flat Package
QIP, Quadruple In- line Package
QUIL, Quad in-Line
QUIP, Quad in-Line Package
QSOP, Quarter Size Outline Packe
SBGA, Super BGA
SCP, Single Chip Packaging
SDIP, Shrink Dual-Inline Package
SECC, Single Edge Contact Cartridge
SEPP, Single Edge Processor Package
SESUB, Semiconductor Embedded in Substrate
SHP, Surface Horizontal Package
SIL, Single Inline
SIMM, Single Inline Memory Module
SIP, Single-Inline Package
SiP, System in Package
SIPP, Single Inline Pinned Package
SLC, Surface Laminar Circuit
SMD, Surface Mounted Device
SO, Small Outline
SoC, System on Chip
SOD, Small Outline Diode Package
SODIMM Small Outline Dual-Inline Memory Module
SOIC, Small Outline Integrated Circuit
SOJ, J-Leaded Small-Outline Package
SOP, Small-Outline Package (Japan)
SOT, Small Outline Transistor
SPGA, Staggered Pin Grid Array
SQFP, Shrink Quad Flat Package
SSI, Small Scale Integration
SSOP, Shrink Small-Outline Package
TBGA, Thin Ball Grid Array
TCP, Tape Carrier Package, 320pin
TCSP, True Chip Size Package
TDFN, Thin Dual Flat No Lead
TDSP, True Die Size Package
TEP, Top Exposed Pad
TEPBGA, thermally enhanced plastic BGA
TFBGA, Thin Fine-Pitch Ball Grid Array
TFP, Triple Flat Pack
TMLFP, Thin Micro Lead Frame Plastic
TO, Transistor Outline
TOS, Tape on Substrate
TQFN, Thin Quad Flat No Lead
TQFP, Thin Quad Flat Package
TSLP, Thin Small Leadless Package
TSOJ, Thin Small Outline J-leaded Package
TSOP, Thin Small-Outline Package
TSOP, Thin Small Outline Transistor
TSSLP, Thin Super Small Leadless Package
TSSOP, Thin Shrink Small-Outline Package
TVFLGA, Thin Very-Fine Land Grid Array
TVSOP, Very Thin Small-Outline Package
UCSP, Wafer Chip Scale Package
UFBGA, Ultra Fine BGA
UFP, Ultra Fine Pitch
ULSI, Ultra Large Scale Integration
URM, Universal Retention Module
UTDFN, Ultra Thin Dual Flat no Lead
VFBGA, Very-Thin Fine-Pitch Ball Grid Array
VLSI, Very Large Scale Integration
VQFP, Very Thin Quad Flat Package
VSO, Very Small Outline
VSoC, Vision System on Chip
VSOP, Very Small Outline Package
WCSP, Wafer Chip Scale Package
WLCSP, Wafer Level Chip Scale Package
WLP, Wafer Level Package
WLCSP, Wafer-Level Chip Scale Package
WSON, Very Very Thin Small Outline No Lead Package
XDFN, Extreme Thin Dual Flat No Lead
ZIF, Zero Insertion Force
ZIP, Zig Zag In-Line Package
µPGA, Micro PGA