small outline package (chip design) (SOP)
In the case of the Small Outline Package(SOP), the connection pins are located on the long sides of the chip component, as in the Dual Inline Package ( DIP), and are bent outwards.
SOPs come with 8, 10, 16, 24, 28, 32, 40 and 44 pins, spaced 1/20 inch(1.27 mm) apart. The numbering of the PINs starts at the notch. The SOP package is available in a wide variety of designs, such as the shrink small outline package( SSOP), the flatter version as the thin small outline package( TSOP), the smaller and flatter version as the thin shrink small outline package( TSSOP) and the extremely small versions as the VSOP (very small) and TVSOP (thin very small).